TECHNOMELT® PS 4144 RE

• Bonds well to low density polyethylene.
• Maintains bond on curved (large and small diameter) surfaces.
• Resistant to wing-up (flagging).
• Suitable for application temperatures down to 40°F.
• Bleed through resistance to 160°F.
• General purpose adhesion to a wide variety of substrates (including recycled corrugated board).
• Very high tack and peel with good shear.

• Paper and film labels
• Polyethylene bag closures
• Transfer tapes and films
• Double-sided tapes

Testing conducted with 1 mil transfer coating on 20 lb copy paper; corrugated test panel.

• Minimum application temperature: 40°F
• Service range: 0 to 160°F

These values represent the service and application temperatures under ideal conditions. Performance should be tested at the actual conditions as a number of factors can cause application failure including construction, application surface, environmental conditions, and coatweight.

• Apply by any conventional method for high viscosity hot melts, including slot (die) or roll.
• It is strongly advised that evaluations of the adhesive be carried out to determine whether the product is suitable for use under individual coater operating conditions.
• Typical adhesive deposition is 0.8 to 1.2 mils for most applications.
• Coat at the lowest practical temperature, above 275°F, to avoid thermal degradation.
• Typical coating temperature range is 275° to 350°F.
• Excessive or prolonged heating should be avoided. Enclosure and blanketing of the molten adhesive with nitrogen is suggested to prevent oxidation.